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19-2492; Rev 1; 8/03
5GHz Low-Noise Amplifier with Shutdown
General Description
The MAX2649 high-linearity, silicon-germanium (SiGe) low-noise amplifier (LNA) is designed for 5GHz wireless LAN systems based on IEEE802.11a and HiperLAN2 standards. The MAX2649 achieves a 2.1dB noise figure, 17dB gain, and 0dBm IIP3, making it ideal as a firststage LNA in 5GHz OFDM WLAN radio systems. This device operates over a +2.7V to +3.6V supply range and features low overall current consumption (12.5mA). The MAX2649 also includes a shutdown mode to save power when the receiver is inactive. The LNA is designed on a low-noise, advanced SiGe process optimized for high-frequency applications. The device is available in a tiny 2 x 3 chip-scale package (UCSPTM) (1mm x 1.5mm). o Low-Noise Figure: 2.1dB o High Gain: 17dB o High IIP3: 0dBm o Shutdown Mode o +2.7V to +3.6V Single-Supply Operation o 1mm x 1.5mm UCSP
Features
o 4.9GHz to 5.9GHz Wideband Operation
MAX2649
Applications
IEEE802.11a Wireless LAN ETSI HiperLAN2 WLAN 5GHz ISM Radios 5GHz Cordless Phones
UCSP is a trademark of Maxim Integrated Products, Inc. Pin Configuration appears at end of data sheet.
PART MAX2649EBT-T
Ordering Information
TEMP RANGE -40 C to +85 C
o o
PIN-PACKAGE 2 x 3 UCSP*
*Requires special solder temperature profile described in the Absolute Maximum Ratings section.
Functional Diagram/Typical Operating Circuit
SHUTDOWN CONTROL TRANSMISSION LINE RF INPUT RFIN A1 BIAS MAX2649 GND A2 A3
B1 VCC VCC GND
B2
B3 RFOUT RF OUTPUT
FOR LAYOUT AND DESIGN DETAILS, PLEASE REFER TO THE MAX2649 EV KIT.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
5GHz Low-Noise Amplifier with Shutdown MAX2649
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +4.2V SHDN to GND.............................................-0.3V to (VCC + 0.3V) RFIN to GND..........................................................-0.3V to +0.9V RFOUT to GND...........................................-0.3V to (VCC + 0.3V) RF Input Power (50 Source) ..........................................+5dBm Continuous Power Dissipation (TA = +70C) 2 x 3 UCSP (derate 24mW/C above +70C) ...............500mW Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Bump Temperature (soldering) (Note 1) Infrared (15s) ...............................................................+220C Vapor Phase (60s) .......................................................+215C
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not recommended.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION! ESD SENSITIVE DEVICE
DC ELECTRICAL CHARACTERISTICS
(VCC = +2.7V to +3.6V, no RF signal applied, VIH = +2.0V, VIL = +0.4V, RFIN and RFOUT terminated to 50 through DC-blocking caps, TA = -40C to +85C. Typical values are at +3.0V and TA = +25C, unless otherwise noted.) (Note 2)
PARAMETER Supply Voltage Active Supply Current Shutdown Supply Current Digital Input Logic High Digital Input Logic Low Digital Input Current SYMBOL VCC ICC ICC VIH VIL SHDN = VIL 2 0.4 5 CONDITIONS MIN 2.7 12.5 0.3 TYP MAX 3.6 20 10 UNITS V mA A V V A
AC ELECTRICAL CHARACTERISTICS
(MAX2649 EV kit, VCC = +3.0V, PIN = -30dBm, RFIN and RFOUT terminated to 50 through DC-blocking caps, VIH = +2.0V, VIL = +0.4V, TA = +25C. Typical values are at fRF = 5250MHz, unless otherwise noted.) (Note 3)
PARAMETER RF Frequency Range Power Gain Gain Variation Over Temperature Noise Figure Input Third-Order Intercept Point Input Return Loss Output Return Loss Reverse Isolation Turn-On Time Turn-Off Time NF IIP3 S11 S22 S12 tON tOFF fRF = 5150MHz to 5350MHz (Note 6) Two tones at 5250MHz and 5251MHz, -30dBm per tone (Note 6) -3.5 SYMBOL fRF S21 (Note 4) fRF = 5150MHz to 5350MHz (Note 5) CONDITIONS MIN 4900 15 17 0.2 2.1 0 -12 -16 -30 0.3 0.5 0.8 1.2 1.5 2.5 TYP MAX 5900 UNITS MHz dB dB dB dBm dB dB dB s s
2
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5GHz Low-Noise Amplifier with Shutdown
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX2649 EV kit, VCC = +3.0V, PIN = -30dBm, RFIN and RFOUT terminated to 50 through DC-blocking caps, VIH = +2.0V, VIL = +0.4V, TA = +25C. Typical values are at fRF = 5250MHz, unless otherwise noted.) (Note 3) Note 2: DC characteristics are production tested at TA = +85C. DC specifications over temperature are guaranteed by design and characterization. Note 3: Specifications are guaranteed by design and characterization. Note 4: Recommended band of operation. Note 5: Specifications are corrected for board losses on the MAX2649 EV kit (0.5dB at input, 0.5dB at output). Note 6: Specifications are corrected for board losses on the MAX2649 EV kit (0.5dB at input).
MAX2649
Typical Operating Characteristics
(Data taken on board optimized for fRF = 5150MHz to 5350MHz.) (VCC = +3.0V, fRF = 5250MHz, PIN = -30dBm, and TA = +25C, unless otherwise noted.)
SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX2649 toc01
GAIN vs. TEMPERATURE
MAX2649 toc02
GAIN vs. SUPPLY VOLTAGE
19 18 GAIN (dB) 17 16 15 14 13 12
MAX2649 toc03
17 16 15 SUPPLY CURRENT (mA) 14 13 12 11 10 9 8 7 TA = -40C TA = +25C TA = +85C
20 19 18 GAIN (dB) 17 16 15 14 13 12
20
2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 SUPPLY VOLTAGE (V)
-40
-15
10
35
60
85
2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 SUPPLY VOLTAGE (V)
TEMPERATURE (C)
P(1dB) vs. SUPPLY VOLTAGE
MAX2649 toc04
IIP3 vs. SUPPLY VOLTAGE
MAX2649 toc05
|S11|, |S12|, |S22| vs. FREQUENCY
-5 -10 MAGNITUDE (dB) -15 -20 -25 -30 -35 -40 |S12| 4900 5100 5300 5500 5700 5900 |S22| |S11|
MAX2649 toc06
-9.50 OUTPUT 1dB COMPRESSION POINT (dBm) -9.55 -9.60
1.0 0.8 0.6 0.4 IIP3 (dBm)
0
-9.65 -9.70 -9.75 -9.80 -9.85 -9.90 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 SUPPLY VOLTAGE (V)
0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 SUPPLY VOLTAGE (V)
FREQUENCY (MHz)
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5GHz Low-Noise Amplifier with Shutdown MAX2649
Typical Operating Characteristics (continued)
(Data taken on board optimized for fRF = 5150MHz to 5350MHz.) (VCC = +3.0V, fRF = 5250MHz, PIN = -30dBm, and TA = +25C, unless otherwise noted.)
|S21| vs. FREQUENCY
MAX2649 toc07
NOISE FIGURE vs. FREQUENCY
4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 4900 5100 5300 5500 5700 OPERATING FREQUENCY (MHz) 3.9 3.7 3.5 3.3 3.1 2.9 2.7 2.5 2.3 2.1 1.9 1.7 1.5 1.3 1.1 0.9 -40
MAX2649 toc08
NOISE FIGURE vs. TEMPERATURE
MAX2649 toc09
20 19 18 17 |S21| (dB) 16 15 14 13 12 11 4900 5100 5300 5500 5700
NF (dB)
5900
5900
NF (dB)
-15
10
35
60
85
OPERATING FREQUENCY (MHz)
TEMPERATURE (C)
TURN-ON TIME
MAX2649 toc10
TURN-OFF TIME
MAX2649 toc11
0 -10 OUTPUT POWER (dBm) -20 -30 -40 -50 -60 -70 0 200 400 600 800
0 -10 OUTPUT POWER (dBm) -20 -30 -40 -50 -60 -70
1000
0
200
400
600
800
1000
TIME (ns)
TIME (ns)
4
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5GHz Low-Noise Amplifier with Shutdown
Pin Description
PIN A1 A2, B2 A3 B1 B3 NAME RFIN GND SHDN VCC RFOUT FUNCTION LNA Input. Requires shunt capacitor and transmission line for input matching. (See the Typical Operating Circuit and refer to the MAX2649 EV kit data sheet for details.) Ground. For optimum performance, provide a low-inductance connection to the ground plane. Shutdown. Apply logic signal through 100 resistor with a 20pF shunt capacitor to ground. Set SHDN high for active operation. Set SHDN low to place the part in shutdown mode. +2.7V to +3.6V Supply Pin. Bypass with 100pF capacitor. (See the Typical Operating Circuit and refer to the MAX2649 EV kit data sheet for details.) LNA Output. Requires external matching network for optimal performance. (See the Typical Operating Circuit and refer to the MAX2649 EV kit data sheet for details.)
MAX2649
Detailed Description
The MAX2649 LNA operates with RF frequencies of 4.9GHz to 5.9GHz. This device is ideal for IEEE802.11a and HiperLAN2 applications. This device is available in a 6-bump UCSP package and contains internal bias circuitry and shutdown circuitry to minimize the number of required external components.
the input. Because the noise figure of the LNA design is severely degraded by low-Q matching components, always design with high-Q wire-wound inductors and low-loss capacitors. Remember that package parasitics must be taken into consideration; always use components with self-resonant frequencies higher than the intended frequency of operation.
Applications Information
Optimal gain and noise-figure performance require input- and output-matching circuits tuned for the band of interest. All electrical specifications and typical operating characteristics are measured on the MAX2649 evaluation kit (EV kit), which is tuned for operation in the 5.15GHz to 5.35GHz band. Referencing the application circuit, PC board layout, and components specified in the MAX2649 EV kit data sheet reduces evaluation and design time for five system designs. For applications in other bands, refer to the MAX2649 S-parameters, noise parameters, and the following comments to aid design. The S-parameters and noise parameters are available at www.maxim-ic.com.
Output Matching
The output of the MAX2649 is an open-collector transistor; the DC bias and RF matching network are off-chip, as illustrated in the Typical Operating Circuit. Bias the output stage with VCC through an RF choke. The collector is in series with a small inductor and then AC-coupled to the RF output. If necessary, place a shunt capacitor to ground at the far end of the inductor to provide better matching. S-parameters and noise parameters can be found at www.maxim-ic.com.
Power-Supply Bypassing
Proper power-supply bypassing is essential for highfrequency circuit stability. Place a small-value capacitor as close to the IC as possible to decouple high-frequency noise. Place a larger-value capacitor near the supply to decouple low-frequency noise. Whenever possible, place the ground-connected side of bypass capacitors within a few millimeters of the IC's ground connections.
Input Matching
The input stage is internally biased, so no external bias circuitry is required at RFIN. Be sure to AC-couple to
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5GHz Low-Noise Amplifier with Shutdown MAX2649
Layout information
A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, EMI, and stray inductance. Use multiple, separate low-inductance-plated vias to the ground plane for each ground bump. The chip-scale package (UCSP) has a bump pitch of 0.5mm (19.7mil) and a bump diameter of 0.3mm (12mil). Therefore, lay out the solder pad spacing on 0.5mm (19.7mil) centers, and use a pad size of 0.25mm (10mil), and a solder mask opening of 0.33mm (13mil). Round or square pads are permissible. Refer to the Maxim application note, Wafer Level Chip-Scale Packaging, for additional detailed information on UCSP layout and handling.
UCSP Reliability
The chip-scale package (UCSP) represents a unique package that greatly reduces board space compared to other packages. UCSP reliability is integrally linked to the user's assembly methods, circuit board material, and usage environment. Operating life test and moisture resistance remains uncompromised, as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater consideration for a UCSP. UCSP solder-joint contact integrity must be considered because the package is attached through direct solder contact to the user's PC board. Testing done to characterize the UCSP reliability performance shows that it is capable of performing reliably through environmental stresses. Results of environmental stress tests and additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim's website, www.maxim-ic.com/ 1st_pages/UCSP.htm.
Pin Configuration
TRANSISTOR COUNT: 471
TOP VIEW B1 VCC B2 GND A1 RFIN
Chip Information
A2 GND
B3 RFOUT
A3 SHDN
6
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5GHz Low-Noise Amplifier with Shutdown
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)
6L, UCSP.EPS
MAX2649
PACKAGE OUTLINE, 3x2 UCSP 21-0097 G
1 1
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
7 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

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